Rebuilt Disco DFG8340 Wafer Lapping System from Mexico
Rebuilt numerically controlled lapping system for semiconductor wafers, achieving sub-micron flatness on silicon substrates using diamond abrasives. Falls under HTS 8460.40.40.10 for rebuilt NC lapping machines finishing metal surfaces.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit OEM rebuild certificates and before/after specs to Customs for used/rebuilt verification
• Label as semiconductor-specific if applicable, but primary classification remains lapping function
• Check for dual-use export controls on precision wafer equipment