8460.40.40.10/Rebuilt Disco DFG8340 Wafer Lapping System/Japan

Rebuilt Disco DFG8340 Wafer Lapping System from Japan

Rebuilt numerically controlled lapping system for semiconductor wafers, achieving sub-micron flatness on silicon substrates using diamond abrasives. Falls under HTS 8460.40.40.10 for rebuilt NC lapping machines finishing metal surfaces.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit OEM rebuild certificates and before/after specs to Customs for used/rebuilt verification

• Label as semiconductor-specific if applicable, but primary classification remains lapping function

• Check for dual-use export controls on precision wafer equipment