Rebuilt Disco DFG8340 Wafer Lapping System from Japan
Rebuilt numerically controlled lapping system for semiconductor wafers, achieving sub-micron flatness on silicon substrates using diamond abrasives. Falls under HTS 8460.40.40.10 for rebuilt NC lapping machines finishing metal surfaces.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit OEM rebuild certificates and before/after specs to Customs for used/rebuilt verification
• Label as semiconductor-specific if applicable, but primary classification remains lapping function
• Check for dual-use export controls on precision wafer equipment