Rebuilt Disco DFG8340 Wafer Lapping System from Germany
Rebuilt numerically controlled lapping system for semiconductor wafers, achieving sub-micron flatness on silicon substrates using diamond abrasives. Falls under HTS 8460.40.40.10 for rebuilt NC lapping machines finishing metal surfaces.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Submit OEM rebuild certificates and before/after specs to Customs for used/rebuilt verification
• Label as semiconductor-specific if applicable, but primary classification remains lapping function
• Check for dual-use export controls on precision wafer equipment