DMG Mori NX7 CNC Tool Grinding Machine
Compact numerically controlled tool grinder for high-precision resharpening of semiconductor wafer dicing saw blades and micro-drills. Supports abrasive belt and wheel finishing for metal and cermet substrates. HTS 8460.31.0080 covers this other NC sharpening machine.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If honing machines
Abrasive honing equipment for internal surfaces uses different subheading even if numerically controlled.
If imported with grinding wheels as set
Abrasive products packaged with machines for retail may classify primarily as grinding wheels.
If for wafer edge grinding
Specialized semiconductor wafer edge grinders/polishers are covered under semiconductor manufacturing statistical provisions.
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Import Tips & Compliance
• Provide wafer fab end-use letters if claiming semiconductor equipment preferences
• Diamond wheel specifications must be documented for cermet tool compatibility
• Machine footprint diagrams aid containerization planning
Related Products under HTS 8460.31.00.80
Haas CNC Tool Grinder Model TG-1
A numerically controlled sharpening machine designed for precision grinding of carbide end mills and drills used in CNC machining centers. It features automatic tool loading and multi-axis control for high-volume production sharpening in semiconductor manufacturing tool maintenance. Classified under HTS 8460.31.0080 as a numerically controlled sharpening machine for tools, not dedicated to gears.
ANCA MX7 CNC Cutter Grinder
Advanced 5-axis CNC grinding machine for resharpening high-precision milling cutters and reamers used in semiconductor fab toolrooms. It supports complex geometries with in-process measurement for sub-micron accuracy. Falls under HTS 8460.31.0080 for numerically controlled tool sharpening machines finishing metal tools via abrasives.
Walter Helitronic Power CNC Tool Grinder
High-performance numerically controlled universal grinder for sharpening rotary tools like drills, mills, and countersinks made from carbide or HSS. Used extensively in semiconductor industry for maintaining wafer processing tooling. HTS 8460.31.0080 applies to its NC-controlled sharpening of metal cutting tools.
Makino S33 Connect CNC Grinder for Tools
Precision 5-axis CNC grinding center optimized for complex tool geometries in semiconductor manufacturing, featuring high-speed spindles and advanced coolant systems. It finishes cermet and metal tools through abrasive processes. Classified in HTS 8460.31.0080 as other numerically controlled sharpening machines.
Star SU TRCEVO CNC Tool Grinder
Versatile numerically controlled grinding machine for sharpening complex profile tools used in semiconductor leadframe stamping and etching processes. Features automatic wheel dressing and tool measurement. Fits HTS 8460.31.0080 as numerically controlled tool sharpening equipment.
Schütte S33.G300 CNC Grinder
High-precision 6-axis CNC grinding machine for micro-tools used in semiconductor probe card manufacturing and wafer probing applications. Employs diamond abrasives for cermet finishing. Classified under HTS 8460.31.0080 for other numerically controlled sharpening machines.