DMG Mori NX7 CNC Tool Grinding Machine from Canada
Compact numerically controlled tool grinder for high-precision resharpening of semiconductor wafer dicing saw blades and micro-drills. Supports abrasive belt and wheel finishing for metal and cermet substrates. HTS 8460.31.0080 covers this other NC sharpening machine.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide wafer fab end-use letters if claiming semiconductor equipment preferences
• Diamond wheel specifications must be documented for cermet tool compatibility
• Machine footprint diagrams aid containerization planning