Schütte S33.G300 CNC Grinder
High-precision 6-axis CNC grinding machine for micro-tools used in semiconductor probe card manufacturing and wafer probing applications. Employs diamond abrasives for cermet finishing. Classified under HTS 8460.31.0080 for other numerically controlled sharpening machines.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If thread grinding machines
NC machines specifically for thread tool sharpening have dedicated provisions.
If for semiconductor class sorting
While primarily grinding, significant class/measuring functions trigger semiconductor statistical note.
If handheld tool sharpeners
Portable battery-operated sharpeners for hand tools classify under different machine categories.
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Import Tips & Compliance
• Sub-micron accuracy certificates support premium classification justification
• Vibration isolation specs important for semiconductor cleanroom import
• German origin may qualify for special duty programs
Related Products under HTS 8460.31.00.80
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High-performance numerically controlled universal grinder for sharpening rotary tools like drills, mills, and countersinks made from carbide or HSS. Used extensively in semiconductor industry for maintaining wafer processing tooling. HTS 8460.31.0080 applies to its NC-controlled sharpening of metal cutting tools.
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Precision 5-axis CNC grinding center optimized for complex tool geometries in semiconductor manufacturing, featuring high-speed spindles and advanced coolant systems. It finishes cermet and metal tools through abrasive processes. Classified in HTS 8460.31.0080 as other numerically controlled sharpening machines.
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Compact numerically controlled tool grinder for high-precision resharpening of semiconductor wafer dicing saw blades and micro-drills. Supports abrasive belt and wheel finishing for metal and cermet substrates. HTS 8460.31.0080 covers this other NC sharpening machine.
Star SU TRCEVO CNC Tool Grinder
Versatile numerically controlled grinding machine for sharpening complex profile tools used in semiconductor leadframe stamping and etching processes. Features automatic wheel dressing and tool measurement. Fits HTS 8460.31.0080 as numerically controlled tool sharpening equipment.