Schütte S33.G300 CNC Grinder from Japan
High-precision 6-axis CNC grinding machine for micro-tools used in semiconductor probe card manufacturing and wafer probing applications. Employs diamond abrasives for cermet finishing. Classified under HTS 8460.31.0080 for other numerically controlled sharpening machines.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Sub-micron accuracy certificates support premium classification justification
• Vibration isolation specs important for semiconductor cleanroom import
• German origin may qualify for special duty programs