Schütte S33.G300 CNC Grinder from Japan
High-precision 6-axis CNC grinding machine for micro-tools used in semiconductor probe card manufacturing and wafer probing applications. Employs diamond abrasives for cermet finishing. Classified under HTS 8460.31.0080 for other numerically controlled sharpening machines.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Sub-micron accuracy certificates support premium classification justification
• Vibration isolation specs important for semiconductor cleanroom import
• German origin may qualify for special duty programs