DMG Mori NX7 CNC Tool Grinding Machine from Japan
Compact numerically controlled tool grinder for high-precision resharpening of semiconductor wafer dicing saw blades and micro-drills. Supports abrasive belt and wheel finishing for metal and cermet substrates. HTS 8460.31.0080 covers this other NC sharpening machine.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide wafer fab end-use letters if claiming semiconductor equipment preferences
• Diamond wheel specifications must be documented for cermet tool compatibility
• Machine footprint diagrams aid containerization planning