DMG Mori NX7 CNC Tool Grinding Machine from China
Compact numerically controlled tool grinder for high-precision resharpening of semiconductor wafer dicing saw blades and micro-drills. Supports abrasive belt and wheel finishing for metal and cermet substrates. HTS 8460.31.0080 covers this other NC sharpening machine.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide wafer fab end-use letters if claiming semiconductor equipment preferences
• Diamond wheel specifications must be documented for cermet tool compatibility
• Machine footprint diagrams aid containerization planning