Used or rebuilt
Machine tools (including way-type unit head machines) for drilling, boring, milling, threading or tapping by removing metal, other than lathes (including turning centers) of heading 8458: > Other drilling machines: > Other > Used or rebuilt
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8459.29.00.10
Rebuilt Radial Drilling Machine
A refurbished radial arm drilling machine for creating precise holes in metal semiconductor processing fixtures and wafer chucks by removing metal. Falls under HTS 8459.29.00.10 due to its used/rebuilt status and drilling function outside lathe operations. Used in fab cleanrooms for equipment maintenance.
Used Gantry-Type Boring Mill
A used gantry-style boring mill for enlarging precise bores in metal vacuum chambers used in semiconductor manufacturing processes. HTS 8459.29.00.10 applies as a rebuilt metal-removing boring machine not qualifying as a lathe. Essential for fabricating high-vacuum equipment in wafer processing.
Used Wafer Chuck Boring Machine
Used precision boring machine for machining semiconductor wafer chucks from metal blocks, ensuring flatness for processing. HTS 8459.29.00.10 for rebuilt boring by metal removal. Ties to wafer preparation equipment indirectly.
Rebuilt Tapping Center
Rebuilt multi-tool tapping center for threading holes in metal semiconductor fixtures like float zone pullers. Classified HTS 8459.29.00.10 as used other metal-removing machine. Supports crystal grower maintenance.
Used Crystal Grinder Fixture Miller
Used milling machine for custom fixtures used in crystal grinders for semiconductor boule preparation. HTS 8459.29.00.10 applies to this rebuilt milling tool.
Rebuilt Wafer Saw Collet Driller
Rebuilt driller for collets in wafer slicing saws, removing metal for precision fit. HTS 8459.29.00.10 for used drilling machine.
Used CNC Vertical Milling Machine
A rebuilt computer numerical control vertical milling machine designed for precision metal removal through milling operations on semiconductor wafers and components. Classified under HTS 8459.29.00.10 as it is used/rebuilt and performs milling by removing metal, distinct from lathes. Commonly employed in semiconductor fabrication for shaping silicon wafers.
Rebuilt Horizontal Milling Center
Refurbished horizontal spindle milling center for machining flat surfaces on metal semiconductor wafer carriers and platens. Classified in HTS 8459.29.00.10 for its used/rebuilt condition and metal removal via milling, excluding lathes. Supports precision in crystal boule processing setups.
Used Multi-Axis Drilling Machine
A used multi-axis CNC drilling machine for creating micro-holes in metal shadow masks used in semiconductor thin-film deposition. HTS 8459.29.00.10 covers this rebuilt drilling tool for metal removal operations. Critical for gallium arsenide wafer fabrication.
Rebuilt Bed-Type Milling Machine
Refurbished bed-type milling machine for contouring metal components in crystal grower assemblies for semiconductor boule production. Under HTS 8459.29.00.10 as used/rebuilt other milling machine removing metal. Aligns with Czochralski method equipment needs.