Rebuilt Horizontal Milling Center

Refurbished horizontal spindle milling center for machining flat surfaces on metal semiconductor wafer carriers and platens. Classified in HTS 8459.29.00.10 for its used/rebuilt condition and metal removal via milling, excluding lathes. Supports precision in crystal boule processing setups.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.2%+35.0%39.2%
🇲🇽Mexico4.2%+10.0%14.2%
🇨🇦Canada4.2%+10.0%14.2%
🇩🇪Germany4.2%+10.0%14.2%
🇯🇵Japan4.2%+10.0%14.2%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8459.69.00Same rate: 39.2%

If way-type unit head construction

Specific unit head milling machines are in 8459.69, differentiated by machine architecture.

8486.40.00Lower: 25% vs 39.2%

If imported as semiconductor machine parts

Parts for semiconductor apparatus classified in 8486, not complete machines.

8465.91.00Lower: 38% vs 39.2%

If for direct wafer material processing

Dedicated semiconductor wafer grinders/polishers per notes go to 8465.91.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

• Require detailed hour meter logs and rebuild invoices; undervaluing used machines leads to audits

• Ensure coolant system is documented as refurbished to meet environmental import regs

Related Products under HTS 8459.29.00.10

Rebuilt Radial Drilling Machine

A refurbished radial arm drilling machine for creating precise holes in metal semiconductor processing fixtures and wafer chucks by removing metal. Falls under HTS 8459.29.00.10 due to its used/rebuilt status and drilling function outside lathe operations. Used in fab cleanrooms for equipment maintenance.

Used Gantry-Type Boring Mill

A used gantry-style boring mill for enlarging precise bores in metal vacuum chambers used in semiconductor manufacturing processes. HTS 8459.29.00.10 applies as a rebuilt metal-removing boring machine not qualifying as a lathe. Essential for fabricating high-vacuum equipment in wafer processing.

Used Wafer Chuck Boring Machine

Used precision boring machine for machining semiconductor wafer chucks from metal blocks, ensuring flatness for processing. HTS 8459.29.00.10 for rebuilt boring by metal removal. Ties to wafer preparation equipment indirectly.

Rebuilt Tapping Center

Rebuilt multi-tool tapping center for threading holes in metal semiconductor fixtures like float zone pullers. Classified HTS 8459.29.00.10 as used other metal-removing machine. Supports crystal grower maintenance.

Used Crystal Grinder Fixture Miller

Used milling machine for custom fixtures used in crystal grinders for semiconductor boule preparation. HTS 8459.29.00.10 applies to this rebuilt milling tool.

Rebuilt Wafer Saw Collet Driller

Rebuilt driller for collets in wafer slicing saws, removing metal for precision fit. HTS 8459.29.00.10 for used drilling machine.