Rebuilt Radial Drilling Machine
A refurbished radial arm drilling machine for creating precise holes in metal semiconductor processing fixtures and wafer chucks by removing metal. Falls under HTS 8459.29.00.10 due to its used/rebuilt status and drilling function outside lathe operations. Used in fab cleanrooms for equipment maintenance.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.2% | +35.0% | 39.2% |
| 🇲🇽Mexico | 4.2% | +10.0% | 14.2% |
| 🇨🇦Canada | 4.2% | +10.0% | 14.2% |
| 🇩🇪Germany | 4.2% | +10.0% | 14.2% |
| 🇯🇵Japan | 4.2% | +10.0% | 14.2% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If configured for threading/tapping operations
Threading machines are separately provided for in 8459.40, based on primary function regardless of condition.
If for toolroom use on semiconductor dies
Toolroom milling/drilling machines shift to Chapter 84 heading 8466 for specific precision applications.
If primarily for testing semiconductor wafers
Statistical notes place wafer testing apparatus in Chapter 90, not metalworking tools.
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Import Tips & Compliance
• Provide photos and serial number history to prove rebuild status; ensure no new parts exceed 50% value to stay in used category
• Label with original and rebuild dates; common issue is misdeclaration as new, triggering higher duties under 8459.29.0010
• Comply with OSHA-equivalent safety certs for import; test for vibration specs critical in semiconductor environments
Related Products under HTS 8459.29.00.10
Used Gantry-Type Boring Mill
A used gantry-style boring mill for enlarging precise bores in metal vacuum chambers used in semiconductor manufacturing processes. HTS 8459.29.00.10 applies as a rebuilt metal-removing boring machine not qualifying as a lathe. Essential for fabricating high-vacuum equipment in wafer processing.
Used Wafer Chuck Boring Machine
Used precision boring machine for machining semiconductor wafer chucks from metal blocks, ensuring flatness for processing. HTS 8459.29.00.10 for rebuilt boring by metal removal. Ties to wafer preparation equipment indirectly.
Rebuilt Tapping Center
Rebuilt multi-tool tapping center for threading holes in metal semiconductor fixtures like float zone pullers. Classified HTS 8459.29.00.10 as used other metal-removing machine. Supports crystal grower maintenance.
Used Crystal Grinder Fixture Miller
Used milling machine for custom fixtures used in crystal grinders for semiconductor boule preparation. HTS 8459.29.00.10 applies to this rebuilt milling tool.
Rebuilt Wafer Saw Collet Driller
Rebuilt driller for collets in wafer slicing saws, removing metal for precision fit. HTS 8459.29.00.10 for used drilling machine.
Used CNC Vertical Milling Machine
A rebuilt computer numerical control vertical milling machine designed for precision metal removal through milling operations on semiconductor wafers and components. Classified under HTS 8459.29.00.10 as it is used/rebuilt and performs milling by removing metal, distinct from lathes. Commonly employed in semiconductor fabrication for shaping silicon wafers.