Used Gantry-Type Boring Mill
A used gantry-style boring mill for enlarging precise bores in metal vacuum chambers used in semiconductor manufacturing processes. HTS 8459.29.00.10 applies as a rebuilt metal-removing boring machine not qualifying as a lathe. Essential for fabricating high-vacuum equipment in wafer processing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.2% | +35.0% | 39.2% |
| 🇲🇽Mexico | 4.2% | +10.0% | 14.2% |
| 🇨🇦Canada | 4.2% | +10.0% | 14.2% |
| 🇩🇪Germany | 4.2% | +10.0% | 14.2% |
| 🇯🇵Japan | 4.2% | +10.0% | 14.2% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If numerically controlled (CNC)
CNC drilling/boring machines are distinctly classified in 8459.21, separate from non-CNC 'other' machines.
If specialized for semiconductor mixing/processing
Semiconductor-specific processing machines move to 8479 per statistical notes on wafer growth equipment.
If for bending/shearing metal sheets first
Preliminary forming operations classify under 8462 before final boring/milling.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Document rebuild process with ISO 9001 compliance to satisfy customs scrutiny on used machinery valuation
• Avoid pitfall of incomplete spindle condition reports; declare accurately to prevent reclassification as scrap
• Include vacuum compatibility certifications for semiconductor end-use declarations
Related Products under HTS 8459.29.00.10
Rebuilt Radial Drilling Machine
A refurbished radial arm drilling machine for creating precise holes in metal semiconductor processing fixtures and wafer chucks by removing metal. Falls under HTS 8459.29.00.10 due to its used/rebuilt status and drilling function outside lathe operations. Used in fab cleanrooms for equipment maintenance.
Used Wafer Chuck Boring Machine
Used precision boring machine for machining semiconductor wafer chucks from metal blocks, ensuring flatness for processing. HTS 8459.29.00.10 for rebuilt boring by metal removal. Ties to wafer preparation equipment indirectly.
Rebuilt Tapping Center
Rebuilt multi-tool tapping center for threading holes in metal semiconductor fixtures like float zone pullers. Classified HTS 8459.29.00.10 as used other metal-removing machine. Supports crystal grower maintenance.
Used Crystal Grinder Fixture Miller
Used milling machine for custom fixtures used in crystal grinders for semiconductor boule preparation. HTS 8459.29.00.10 applies to this rebuilt milling tool.
Rebuilt Wafer Saw Collet Driller
Rebuilt driller for collets in wafer slicing saws, removing metal for precision fit. HTS 8459.29.00.10 for used drilling machine.
Used CNC Vertical Milling Machine
A rebuilt computer numerical control vertical milling machine designed for precision metal removal through milling operations on semiconductor wafers and components. Classified under HTS 8459.29.00.10 as it is used/rebuilt and performs milling by removing metal, distinct from lathes. Commonly employed in semiconductor fabrication for shaping silicon wafers.