Used Multi-Axis Drilling Machine
A used multi-axis CNC drilling machine for creating micro-holes in metal shadow masks used in semiconductor thin-film deposition. HTS 8459.29.00.10 covers this rebuilt drilling tool for metal removal operations. Critical for gallium arsenide wafer fabrication.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.2% | +35.0% | 39.2% |
| 🇲🇽Mexico | 4.2% | +10.0% | 14.2% |
| 🇨🇦Canada | 4.2% | +10.0% | 14.2% |
| 🇩🇪Germany | 4.2% | +10.0% | 14.2% |
| 🇯🇵Japan | 4.2% | +10.0% | 14.2% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If single-spindle numerically controlled
NC single-spindle drills in 8459.11; multi-axis may qualify if not 'other'.
If for semiconductor testing patterns
Testing machines for devices shift to Chapter 90 per statistical notes.
If as part of wafer testing apparatus
Semiconductor testing equipment classified functionally in 8479.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Calibrate and certify axis precision pre-shipment; discrepancies cause reclassification
• Declare software version if CNC-included; pirated software risks seizure
Related Products under HTS 8459.29.00.10
Rebuilt Radial Drilling Machine
A refurbished radial arm drilling machine for creating precise holes in metal semiconductor processing fixtures and wafer chucks by removing metal. Falls under HTS 8459.29.00.10 due to its used/rebuilt status and drilling function outside lathe operations. Used in fab cleanrooms for equipment maintenance.
Used Gantry-Type Boring Mill
A used gantry-style boring mill for enlarging precise bores in metal vacuum chambers used in semiconductor manufacturing processes. HTS 8459.29.00.10 applies as a rebuilt metal-removing boring machine not qualifying as a lathe. Essential for fabricating high-vacuum equipment in wafer processing.
Used Wafer Chuck Boring Machine
Used precision boring machine for machining semiconductor wafer chucks from metal blocks, ensuring flatness for processing. HTS 8459.29.00.10 for rebuilt boring by metal removal. Ties to wafer preparation equipment indirectly.
Rebuilt Tapping Center
Rebuilt multi-tool tapping center for threading holes in metal semiconductor fixtures like float zone pullers. Classified HTS 8459.29.00.10 as used other metal-removing machine. Supports crystal grower maintenance.
Used Crystal Grinder Fixture Miller
Used milling machine for custom fixtures used in crystal grinders for semiconductor boule preparation. HTS 8459.29.00.10 applies to this rebuilt milling tool.
Rebuilt Wafer Saw Collet Driller
Rebuilt driller for collets in wafer slicing saws, removing metal for precision fit. HTS 8459.29.00.10 for used drilling machine.