Other
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8426, 8429 or 8430: > Other: > Of machinery of heading 8426 > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8431.49.10.80
Double-Sided Wafer Lapper Conditioning Ring
Diamond-embedded conditioning ring used to dress lapping plates in simultaneous double-side wafer lappers. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.
CMP Wafer Polisher Head Retaining Ring
Consumable retaining ring in chemical mechanical polishing heads that contains slurry and wafer during planarization. HTS 8431.49.10.80 part for heading 8426 semiconductor wafer polishers.
Crystal Puller Seed Chuck Holder
Rotatable holder mechanism for seed crystals dipped into molten silicon during Czochralski boule pulling. Classified HTS 8431.49.10.80 as part of heading 8426 crystal grower equipment.
Wafer Grinder Air Bearing Spindle
High-precision air bearing spindle providing vibration-free rotation for wafer grinding wheels. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor wafer grinders.
Multi-Wire Wafer Saw Wire Tensioner
Servo-controlled tensioning mechanism maintaining uniform tension across hundreds of diamond wires in multi-wire wafer saws. HTS 8431.49.10.80 part for heading 8426 semiconductor slicing saws.
Wafer Lapping Machine Carrier Plate
Thin stainless steel carrier holding individual wafers between lapping plates during simultaneous thickness reduction. Classified under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.
Czochralski Crystal Puller Heating Element
A graphite or molybdenum heating element designed specifically for use in Czochralski crystal pullers to melt polysilicon for monocrystalline boule growth. It falls under HTS 8431.49.10.80 as a part of semiconductor wafer manufacturing equipment classified in heading 8426. Essential for maintaining precise temperatures in crystal growers.
Float Zone Crystal Grower RF Coil
Radio frequency induction coil used in float zone furnaces to produce high-purity silicon crystals by localized melting without crucibles. Classified under HTS 8431.49.10.80 as a component of heading 8426 semiconductor processing machinery. Critical for zone refining in wafer boule production.
Semiconductor Crystal Boule Grinder Chuck
Precision vacuum chuck for holding crystal boules during diameter grinding in semiconductor wafer preparation equipment. Falls under HTS 8431.49.10.80 as a part of heading 8426 crystal grinders used to prepare boules for wafer slicing.
Wafer Slicing Diamond Wire Guide
Ceramic guide pulley for diamond wire saws that slice semiconductor wafers from monocrystalline boules. Classified in HTS 8431.49.10.80 as part of heading 8426 wafer slicing equipment essential for semiconductor manufacturing.
Silicon Wafer Lapping Plate
Cast iron or copper lapping plate used in semiconductor wafer grinders to achieve precise thickness uniformity before polishing. Under HTS 8431.49.10.80 as part of heading 8426 wafer preparation machinery for semiconductor fabrication.
Wafer Polishing Slurry Distribution Ring
Precision-machined ring that evenly distributes chemical slurry across wafer polishers in semiconductor wafer preparation lines. Classified HTS 8431.49.10.80 as component of heading 8426 polishers critical for wafer flatness.
Crystal Grinder Coolant Nozzle Assembly
Adjustable nozzle manifold delivering coolant to diamond wheels during semiconductor boule grinding operations. HTS 8431.49.10.80 part for heading 8426 crystal grinders ensuring thermal stability.
Wafer Slicing Saw Coolant Pump Impeller
Specialized impeller for high-pressure coolant pumps in diamond wire wafer slicing saws used in semiconductor production. Classified under HTS 8431.49.10.80 as part of heading 8426 slicing machinery.
Semiconductor Wafer Edge Grinder Wheel Arbor
Precision spindle arbor holding diamond wheels for wafer edge profiling after slicing. HTS 8431.49.10.80 part for heading 8426 semiconductor wafer grinder equipment.