Multi-Wire Wafer Saw Wire Tensioner

Servo-controlled tensioning mechanism maintaining uniform tension across hundreds of diamond wires in multi-wire wafer saws. HTS 8431.49.10.80 part for heading 8426 semiconductor slicing saws.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8431.39.00Same rate: 35%

If general saw parts

Tensioners not specific to wafer slicing fall under other heading 8431 saw provisions.

9031.80.80Same rate: 35%

If measuring/controlling instruments

Devices primarily for tension measurement classify in chapter 90.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide servo motor specs and wire count compatibility; declare tension force range; ensure vibration isolation design

Related Products under HTS 8431.49.10.80

Double-Sided Wafer Lapper Conditioning Ring

Diamond-embedded conditioning ring used to dress lapping plates in simultaneous double-side wafer lappers. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.

CMP Wafer Polisher Head Retaining Ring

Consumable retaining ring in chemical mechanical polishing heads that contains slurry and wafer during planarization. HTS 8431.49.10.80 part for heading 8426 semiconductor wafer polishers.

Crystal Puller Seed Chuck Holder

Rotatable holder mechanism for seed crystals dipped into molten silicon during Czochralski boule pulling. Classified HTS 8431.49.10.80 as part of heading 8426 crystal grower equipment.

Wafer Grinder Air Bearing Spindle

High-precision air bearing spindle providing vibration-free rotation for wafer grinding wheels. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor wafer grinders.

Wafer Lapping Machine Carrier Plate

Thin stainless steel carrier holding individual wafers between lapping plates during simultaneous thickness reduction. Classified under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.

Czochralski Crystal Puller Heating Element

A graphite or molybdenum heating element designed specifically for use in Czochralski crystal pullers to melt polysilicon for monocrystalline boule growth. It falls under HTS 8431.49.10.80 as a part of semiconductor wafer manufacturing equipment classified in heading 8426. Essential for maintaining precise temperatures in crystal growers.