Crystal Grinder Coolant Nozzle Assembly
Adjustable nozzle manifold delivering coolant to diamond wheels during semiconductor boule grinding operations. HTS 8431.49.10.80 part for heading 8426 crystal grinders ensuring thermal stability.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If integral to pulley drive system
Nozzles with motion control functions might classify with heading 8426 complete machines.
If predominantly pump components
Assemblies primarily for fluid pumping fall under chapter 84 pump parts.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify coolant flow rates and pressure ratings; provide mounting compatibility with specific grinder models; avoid general machine shop classification
Related Products under HTS 8431.49.10.80
Double-Sided Wafer Lapper Conditioning Ring
Diamond-embedded conditioning ring used to dress lapping plates in simultaneous double-side wafer lappers. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.
CMP Wafer Polisher Head Retaining Ring
Consumable retaining ring in chemical mechanical polishing heads that contains slurry and wafer during planarization. HTS 8431.49.10.80 part for heading 8426 semiconductor wafer polishers.
Crystal Puller Seed Chuck Holder
Rotatable holder mechanism for seed crystals dipped into molten silicon during Czochralski boule pulling. Classified HTS 8431.49.10.80 as part of heading 8426 crystal grower equipment.
Wafer Grinder Air Bearing Spindle
High-precision air bearing spindle providing vibration-free rotation for wafer grinding wheels. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor wafer grinders.
Multi-Wire Wafer Saw Wire Tensioner
Servo-controlled tensioning mechanism maintaining uniform tension across hundreds of diamond wires in multi-wire wafer saws. HTS 8431.49.10.80 part for heading 8426 semiconductor slicing saws.
Wafer Lapping Machine Carrier Plate
Thin stainless steel carrier holding individual wafers between lapping plates during simultaneous thickness reduction. Classified under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.