Wafer Slicing Saw Coolant Pump Impeller
Specialized impeller for high-pressure coolant pumps in diamond wire wafer slicing saws used in semiconductor production. Classified under HTS 8431.49.10.80 as part of heading 8426 slicing machinery.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general industrial centrifugal pumps
Impellers not proven specific to wafer saws classify as pump parts.
If carbon/silicon carbide construction
Articles of silicon carbide are classified by material when not identifiable as specific parts.
Not sure which classification is right?
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Import Tips & Compliance
• Document material (e.g
• silicon carbide) for slurry resistance; declare RPM and pressure specs; ensure balance certification
Related Products under HTS 8431.49.10.80
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Wafer Grinder Air Bearing Spindle
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Multi-Wire Wafer Saw Wire Tensioner
Servo-controlled tensioning mechanism maintaining uniform tension across hundreds of diamond wires in multi-wire wafer saws. HTS 8431.49.10.80 part for heading 8426 semiconductor slicing saws.
Wafer Lapping Machine Carrier Plate
Thin stainless steel carrier holding individual wafers between lapping plates during simultaneous thickness reduction. Classified under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.