Semiconductor Crystal Boule Grinder Chuck
Precision vacuum chuck for holding crystal boules during diameter grinding in semiconductor wafer preparation equipment. Falls under HTS 8431.49.10.80 as a part of heading 8426 crystal grinders used to prepare boules for wafer slicing.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general precision grinding machines
Chucks for non-semiconductor specific grinders fall under heading 8466 for tool parts.
If vacuum-holding function predominates
If primarily a vacuum pump part rather than grinder component, classification shifts to chapter 84 vacuum apparatus.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide boule diameter specifications matching standard semiconductor sizes (150-450mm); ensure flatness tolerance documentation; avoid classification as general grinding machine parts
Related Products under HTS 8431.49.10.80
Double-Sided Wafer Lapper Conditioning Ring
Diamond-embedded conditioning ring used to dress lapping plates in simultaneous double-side wafer lappers. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.
CMP Wafer Polisher Head Retaining Ring
Consumable retaining ring in chemical mechanical polishing heads that contains slurry and wafer during planarization. HTS 8431.49.10.80 part for heading 8426 semiconductor wafer polishers.
Crystal Puller Seed Chuck Holder
Rotatable holder mechanism for seed crystals dipped into molten silicon during Czochralski boule pulling. Classified HTS 8431.49.10.80 as part of heading 8426 crystal grower equipment.
Wafer Grinder Air Bearing Spindle
High-precision air bearing spindle providing vibration-free rotation for wafer grinding wheels. Under HTS 8431.49.10.80 as part of heading 8426 semiconductor wafer grinders.
Multi-Wire Wafer Saw Wire Tensioner
Servo-controlled tensioning mechanism maintaining uniform tension across hundreds of diamond wires in multi-wire wafer saws. HTS 8431.49.10.80 part for heading 8426 semiconductor slicing saws.
Wafer Lapping Machine Carrier Plate
Thin stainless steel carrier holding individual wafers between lapping plates during simultaneous thickness reduction. Classified under HTS 8431.49.10.80 as part of heading 8426 semiconductor lapping equipment.