Semiconductor Crystal Boule Grinder Chuck from Mexico
Precision vacuum chuck for holding crystal boules during diameter grinding in semiconductor wafer preparation equipment. Falls under HTS 8431.49.10.80 as a part of heading 8426 crystal grinders used to prepare boules for wafer slicing.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide boule diameter specifications matching standard semiconductor sizes (150-450mm); ensure flatness tolerance documentation; avoid classification as general grinding machine parts