Semiconductor Crystal Boule Grinder Chuck from Mexico
Precision vacuum chuck for holding crystal boules during diameter grinding in semiconductor wafer preparation equipment. Falls under HTS 8431.49.10.80 as a part of heading 8426 crystal grinders used to prepare boules for wafer slicing.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide boule diameter specifications matching standard semiconductor sizes (150-450mm); ensure flatness tolerance documentation; avoid classification as general grinding machine parts