Other
Machinery, plant or laboratory equipment, whether or not electrically heated (excluding furnaces, ovens and other equipment of heading 8514), for the treatment of materials by a process involving a change of temperature such as heating, cooking, roasting, distilling, rectifying, sterilizing, pasteurizing, steaming, drying, evaporating, vaporizing, condensing or cooling, other than machinery or plant of a kind used for domestic purposes; instantaneous or storage water heaters, nonelectric; parts thereof: > Other machinery, plant or equipment: > Other: > Other: > Other > Designed for cooling: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Products classified under HTS 8419.89.95.40
Wafer Crystal Grinder Coolant System
Coolant delivery and temperature control system for crystal grinders preparing semiconductor boules to precise diameters per statistical note (a)(ii)(A). Maintains grinding wheel and boule temperatures for accuracy. HTS 8419.89.9540 cooling for wafer preparation.
Laser Anneal Cooling Water System
High-flow deionized water cooling system for millisecond laser annealing equipment, rapidly cooling wafer backside post 1300°C melt for junction engineering. Classifies 8419.89.9540 as semiconductor processing cooling excluding domestic use.
Semiconductor Wafer Chiller
A precision cooling unit designed for rapid temperature control of silicon wafers during semiconductor processing to prevent thermal damage. It falls under HTS 8419.89.9540 as machinery for cooling semiconductor materials by changing temperature in a controlled industrial process. Excludes domestic use and focuses on high-precision fab applications.
Crystal Boule Cooling Station
Industrial cooling apparatus for controlled annealing of monocrystalline silicon boules after Czochralski crystal growth, preventing defects from thermal stress. Classified in 8419.89.9540 for semiconductor material treatment involving precise temperature reduction. Essential for wafer manufacturing preparation.
Wafer Lapping Coolant Circulator
Temperature-controlled coolant circulation system for wafer grinders and lappers, maintaining optimal slurry temperatures during semiconductor wafer preparation. HTS 8419.89.9540 covers this cooling machinery for material treatment in wafer fab processes. Ensures flatness tolerances per statistical notes.
Epitaxial Reactor Cold Wall System
Cold wall cooling assembly for MOCVD epitaxial reactors, maintaining chamber walls at stable low temperatures during high-heat thin film deposition on wafers. Falls under 8419.89.9540 as cooling equipment for semiconductor processing temperature management. Critical for layer uniformity.
Float Zone Crystal Cooling Trough
Liquid-cooled trough system for float zone silicon crystal growth, rapidly quenching the molten zone to form defect-free monocrystalline ingots for wafer slicing. HTS 8419.89.9540 for specialized cooling in semiconductor boule manufacturing. Matches statistical note (a)(i).
Wafer Polishing Slurry Temperature Controller
Precision chiller maintaining chemical mechanical polishing (CMP) slurry at exact temperatures for final wafer surface preparation before device fabrication. Classifies 8419.89.9540 as cooling equipment for semiconductor wafer processing per statistical notes. Ensures planarity for lithography.
Ion Implanter Cooling Skid
Integrated cooling skid for high-power ion implanters, dissipating heat from beamline and target chamber during dopant implantation into semiconductor wafers. HTS 8419.89.9540 for production cooling machinery in device fabrication. Handles extreme thermal loads.
RTP Rapid Thermal Processor Chiller
High-capacity chiller for rapid thermal processing (RTP) systems, enabling millisecond temperature ramps up to 1200°C followed by controlled cooling for wafer annealing. 8419.89.9540 for semiconductor thermal treatment cooling equipment. Critical for dopant activation.
Photoresist Coat Track Chiller
Chiller unit for photoresist coating track modules, maintaining developer and rinse temperatures during wafer photolithography preparation. 8419.89.9540 for semiconductor process cooling excluding domestic equipment. Ensures critical dimension control.
Plasma Etch Chamber Cooling Loop
Closed-loop cooling system for plasma etch reactor chambers, removing heat from RF electrodes and wafer chucks during dielectric etch processes. HTS 8419.89.9540 machinery for semiconductor temperature-controlled material treatment. Handles 500W+ power densities.
Wafer Slicing Saw Coolant Chiller
Temperature-controlled coolant chiller for inner diameter wafer slicing saws per statistical note (a)(ii)(B), preventing thermal cracking of thin silicon wafers from boules. 8419.89.9540 for semiconductor wafer preparation cooling equipment.
CVD Deposition Chamber Heat Exchanger
Plate heat exchanger for chemical vapor deposition chambers, cooling precursor gases and reactor walls during thin film deposition on semiconductor wafers. 8419.89.9540 for temperature change treatment in semiconductor manufacturing.
Test Wafer Cooling Station
Cooling station for monitor/test wafers used in semiconductor equipment qualification, rapidly bringing 300mm wafers from process temperatures to ambient. HTS 8419.89.9540 cooling for semiconductor testing preparation per statistical notes. Used before metrology.