Semiconductor Wafer Back Grinder
Back grinders thin the reverse side of semiconductor wafers to target thickness for packaging, HTS 8412.90.90.85 classification as wafer grinder parts. Supports temporary bonding processes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If integrated into full backgrind station
Complete semiconductor processing stations use 8486.
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Import Tips & Compliance
• Specify temporary bond/debond compatibility in descriptions
• Classify tape frames separately under plastics headings
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