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8412.90.90.85/Semiconductor Wafer Back Grinder/Germany

Semiconductor Wafer Back Grinder from Germany

Back grinders thin the reverse side of semiconductor wafers to target thickness for packaging, HTS 8412.90.90.85 classification as wafer grinder parts. Supports temporary bonding processes.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify temporary bond/debond compatibility in descriptions

• Classify tape frames separately under plastics headings