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8412.90.90.85/Semiconductor Wafer Back Grinder/Germany

Semiconductor Wafer Back Grinder from Germany

Back grinders thin the reverse side of semiconductor wafers to target thickness for packaging, HTS 8412.90.90.85 classification as wafer grinder parts. Supports temporary bonding processes.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Specify temporary bond/debond compatibility in descriptions

• Classify tape frames separately under plastics headings

Semiconductor Wafer Back Grinder from Germany — Import Duty Rate | HTS 8412.90.90.85