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Other engines and motors, and parts thereof: > Parts: > Other > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8412.90.90.85
Precision Wafer Thickness Gauge Motor
Motors driving precision thickness measurement in wafer grinding lines, under HTS 8412.90.90.85 for semiconductor equipment integration. Ensures dimensional compliance.
Vacuum Wafer Chuck Drive Motor
Drive motors for vacuum chucks holding wafers during grinding/lapping operations, HTS 8412.90.90.85 as semiconductor wafer prep parts. Maintains position accuracy.
High-Speed Wafer Spindle Motor
High RPM spindle motors powering wafer grinding heads to >10,000 RPM, under HTS 8412.90.90.85 for precision semiconductor surface preparation. Enables fine material removal.
Czochralski Crystal Puller
A Czochralski crystal puller is used to produce extremely pure monocrystalline semiconductor boules from which silicon wafers are sliced, fitting under HTS 8412.90.90.85 as a part of semiconductor manufacturing equipment powered by reaction engines or motors. It employs the Czochralski method for growing semiconductor crystals like silicon and gallium arsenide.
Float Zone Crystal Grower
Float zone crystal growers produce high-purity monocrystalline semiconductor boules using the float zone method, classified as parts of other engines and motors under HTS 8412.90.90.85 for semiconductor wafer production. Critical for processing silicon and similar materials into device-ready forms.
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor crystal boules to exact diameters and flats indicating conductivity and resistivity, falling under HTS 8412.90.90.85 as parts of engines/motors in wafer preparation equipment. Essential for semiconductor manufacturing tolerance preparation.
Wafer Slicing Diamond Saw
Wafer slicing diamond saws cut thin wafers from monocrystalline semiconductor boules, classified under HTS 8412.90.90.85 as motor parts for semiconductor wafer manufacturing equipment. They ensure precise slicing for subsequent device fabrication processes.
Semiconductor Wafer Grinder
Semiconductor wafer grinders reduce wafer thickness to precise tolerances post-slicing, under HTS 8412.90.90.85 as parts of wafer preparation motors/engines. Vital for achieving flatness required in device fabrication.
Chemical Mechanical Wafer Polisher
Chemical mechanical planarization (CMP) polishers flatten semiconductor wafers using slurry and pad abrasion, under HTS 8412.90.90.85 as polishing equipment parts for wafer prep. Critical final step before circuit fabrication.
Wafer Edge Profiling Grinder
Wafer edge profiling grinders shape wafer peripheries to prevent chipping during handling, classified HTS 8412.90.90.85 as semiconductor prep motor parts. Ensures safe wafer transport in fabs.
Crystal Ingot Notching Machine
Crystal ingot notching machines cut orientation flats on semiconductor boules to indicate crystal plane and doping, under HTS 8412.90.90.85. Part of boule grinding per statistical notes.
Double-Sided Wafer Lapper
Double-sided wafer lappers simultaneously process both wafer surfaces for superior flatness, under HTS 8412.90.90.85 as specialized lapping parts. Used for high-precision device wafers.
Stress Relief Wafer Annealer Motor Assembly
Motor assemblies for wafer annealers relieve grinding-induced stresses through controlled heating, classified HTS 8412.90.90.85 as semiconductor processing parts. Improves wafer yield.
Wafer Lapping Machine
Wafer lapping machines use abrasive slurries to achieve ultra-flat surfaces on semiconductor wafers for fabrication readiness, classified as HTS 8412.90.90.85 parts. They correct thickness variations from prior slicing and grinding steps.
Semiconductor Wafer Back Grinder
Back grinders thin the reverse side of semiconductor wafers to target thickness for packaging, HTS 8412.90.90.85 classification as wafer grinder parts. Supports temporary bonding processes.