Semiconductor Wafer Grinder

Semiconductor wafer grinders reduce wafer thickness to precise tolerances post-slicing, under HTS 8412.90.90.85 as parts of wafer preparation motors/engines. Vital for achieving flatness required in device fabrication.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.40.00Lower: 25% vs 35%

If dedicated semiconductor wafer processing machine

Full wafer fab prep machines go to 8486 per statistical notes.

9018.90.60.00Same rate: 35%

If for optical element fabrication

Similar grinders for lenses or optics classify under Chapter 90.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include flatness tolerance data (e.g

<1 micron) to prove semiconductor use

Bundle with boule processing equipment declarations for consistent treatment

Watch for reclassification risks if marketed for general optics grinding

Related Products under HTS 8412.90.90.85

Precision Wafer Thickness Gauge Motor

Motors driving precision thickness measurement in wafer grinding lines, under HTS 8412.90.90.85 for semiconductor equipment integration. Ensures dimensional compliance.

Vacuum Wafer Chuck Drive Motor

Drive motors for vacuum chucks holding wafers during grinding/lapping operations, HTS 8412.90.90.85 as semiconductor wafer prep parts. Maintains position accuracy.

High-Speed Wafer Spindle Motor

High RPM spindle motors powering wafer grinding heads to >10,000 RPM, under HTS 8412.90.90.85 for precision semiconductor surface preparation. Enables fine material removal.

Czochralski Crystal Puller

A Czochralski crystal puller is used to produce extremely pure monocrystalline semiconductor boules from which silicon wafers are sliced, fitting under HTS 8412.90.90.85 as a part of semiconductor manufacturing equipment powered by reaction engines or motors. It employs the Czochralski method for growing semiconductor crystals like silicon and gallium arsenide.

Float Zone Crystal Grower

Float zone crystal growers produce high-purity monocrystalline semiconductor boules using the float zone method, classified as parts of other engines and motors under HTS 8412.90.90.85 for semiconductor wafer production. Critical for processing silicon and similar materials into device-ready forms.

Crystal Boule Grinder

Crystal boule grinders precisely grind semiconductor crystal boules to exact diameters and flats indicating conductivity and resistivity, falling under HTS 8412.90.90.85 as parts of engines/motors in wafer preparation equipment. Essential for semiconductor manufacturing tolerance preparation.