Semiconductor Wafer Grinder from Japan
Semiconductor wafer grinders reduce wafer thickness to precise tolerances post-slicing, under HTS 8412.90.90.85 as parts of wafer preparation motors/engines. Vital for achieving flatness required in device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include flatness tolerance data (e.g
• <1 micron) to prove semiconductor use
• Bundle with boule processing equipment declarations for consistent treatment
• Watch for reclassification risks if marketed for general optics grinding