8412.90.90.85/Semiconductor Wafer Grinder/Japan

Semiconductor Wafer Grinder from Japan

Semiconductor wafer grinders reduce wafer thickness to precise tolerances post-slicing, under HTS 8412.90.90.85 as parts of wafer preparation motors/engines. Vital for achieving flatness required in device fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include flatness tolerance data (e.g

• <1 micron) to prove semiconductor use

• Bundle with boule processing equipment declarations for consistent treatment

• Watch for reclassification risks if marketed for general optics grinding