Chemical Mechanical Wafer Polisher
Chemical mechanical planarization (CMP) polishers flatten semiconductor wafers using slurry and pad abrasion, under HTS 8412.90.90.85 as polishing equipment parts for wafer prep. Critical final step before circuit fabrication.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If as complete semiconductor testing/processing apparatus
CMP tools often fall under 8486 for wafer fabrication equipment.
If steam/chemical surface treatment emphasized
Chemical treatment machines for surfaces classify differently.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide CMP process descriptions matching statistical note (b)(ii)(C)
• Classify polish pads separately under 6804 if imported as consumables
• Monitor for EAR/ITAR restrictions on advanced nano-precision polishers
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Czochralski Crystal Puller
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Float Zone Crystal Grower
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Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor crystal boules to exact diameters and flats indicating conductivity and resistivity, falling under HTS 8412.90.90.85 as parts of engines/motors in wafer preparation equipment. Essential for semiconductor manufacturing tolerance preparation.