Chemical Mechanical Wafer Polisher

Chemical mechanical planarization (CMP) polishers flatten semiconductor wafers using slurry and pad abrasion, under HTS 8412.90.90.85 as polishing equipment parts for wafer prep. Critical final step before circuit fabrication.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.40.00Lower: 25% vs 35%

If as complete semiconductor testing/processing apparatus

CMP tools often fall under 8486 for wafer fabrication equipment.

8424.30.90.00Same rate: 35%

If steam/chemical surface treatment emphasized

Chemical treatment machines for surfaces classify differently.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide CMP process descriptions matching statistical note (b)(ii)(C)

Classify polish pads separately under 6804 if imported as consumables

Monitor for EAR/ITAR restrictions on advanced nano-precision polishers

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Motors driving precision thickness measurement in wafer grinding lines, under HTS 8412.90.90.85 for semiconductor equipment integration. Ensures dimensional compliance.

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Drive motors for vacuum chucks holding wafers during grinding/lapping operations, HTS 8412.90.90.85 as semiconductor wafer prep parts. Maintains position accuracy.

High-Speed Wafer Spindle Motor

High RPM spindle motors powering wafer grinding heads to >10,000 RPM, under HTS 8412.90.90.85 for precision semiconductor surface preparation. Enables fine material removal.

Czochralski Crystal Puller

A Czochralski crystal puller is used to produce extremely pure monocrystalline semiconductor boules from which silicon wafers are sliced, fitting under HTS 8412.90.90.85 as a part of semiconductor manufacturing equipment powered by reaction engines or motors. It employs the Czochralski method for growing semiconductor crystals like silicon and gallium arsenide.

Float Zone Crystal Grower

Float zone crystal growers produce high-purity monocrystalline semiconductor boules using the float zone method, classified as parts of other engines and motors under HTS 8412.90.90.85 for semiconductor wafer production. Critical for processing silicon and similar materials into device-ready forms.

Crystal Boule Grinder

Crystal boule grinders precisely grind semiconductor crystal boules to exact diameters and flats indicating conductivity and resistivity, falling under HTS 8412.90.90.85 as parts of engines/motors in wafer preparation equipment. Essential for semiconductor manufacturing tolerance preparation.