8412.90.90.85/Chemical Mechanical Wafer Polisher/Germany

Chemical Mechanical Wafer Polisher from Germany

Chemical mechanical planarization (CMP) polishers flatten semiconductor wafers using slurry and pad abrasion, under HTS 8412.90.90.85 as polishing equipment parts for wafer prep. Critical final step before circuit fabrication.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Provide CMP process descriptions matching statistical note (b)(ii)(C)

• Classify polish pads separately under 6804 if imported as consumables

• Monitor for EAR/ITAR restrictions on advanced nano-precision polishers