Chemical Mechanical Wafer Polisher from Mexico
Chemical mechanical planarization (CMP) polishers flatten semiconductor wafers using slurry and pad abrasion, under HTS 8412.90.90.85 as polishing equipment parts for wafer prep. Critical final step before circuit fabrication.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Provide CMP process descriptions matching statistical note (b)(ii)(C)
• Classify polish pads separately under 6804 if imported as consumables
• Monitor for EAR/ITAR restrictions on advanced nano-precision polishers