Chemical Mechanical Wafer Polisher from Japan
Chemical mechanical planarization (CMP) polishers flatten semiconductor wafers using slurry and pad abrasion, under HTS 8412.90.90.85 as polishing equipment parts for wafer prep. Critical final step before circuit fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide CMP process descriptions matching statistical note (b)(ii)(C)
• Classify polish pads separately under 6804 if imported as consumables
• Monitor for EAR/ITAR restrictions on advanced nano-precision polishers