8412.90.90.85/Semiconductor Wafer Back Grinder/Canada

Semiconductor Wafer Back Grinder from Canada

Back grinders thin the reverse side of semiconductor wafers to target thickness for packaging, HTS 8412.90.90.85 classification as wafer grinder parts. Supports temporary bonding processes.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify temporary bond/debond compatibility in descriptions

• Classify tape frames separately under plastics headings