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8412.90.90.85/Semiconductor Wafer Back Grinder/Canada

Semiconductor Wafer Back Grinder from Canada

Back grinders thin the reverse side of semiconductor wafers to target thickness for packaging, HTS 8412.90.90.85 classification as wafer grinder parts. Supports temporary bonding processes.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Specify temporary bond/debond compatibility in descriptions

• Classify tape frames separately under plastics headings

Semiconductor Wafer Back Grinder from Canada — Import Duty Rate | HTS 8412.90.90.85