</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8412.90.90.85/Semiconductor Wafer Back Grinder/Japan

Semiconductor Wafer Back Grinder from Japan

Back grinders thin the reverse side of semiconductor wafers to target thickness for packaging, HTS 8412.90.90.85 classification as wafer grinder parts. Supports temporary bonding processes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify temporary bond/debond compatibility in descriptions

• Classify tape frames separately under plastics headings

Semiconductor Wafer Back Grinder from Japan — Import Duty Rate | HTS 8412.90.90.85