8412.90.90.85/Semiconductor Wafer Back Grinder/Japan

Semiconductor Wafer Back Grinder from Japan

Back grinders thin the reverse side of semiconductor wafers to target thickness for packaging, HTS 8412.90.90.85 classification as wafer grinder parts. Supports temporary bonding processes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

Calculate with your customs value Verify with the Tariff Assistant

Import Tips

• Specify temporary bond/debond compatibility in descriptions

• Classify tape frames separately under plastics headings