SICK Rodless Cylinder for Wafer Lapping
Custom SICK rodless cylinders designed for semiconductor wafer lapping/polishing equipment, ensuring ultra-flat surfaces. HTS 8412.21.0060 for rodless linear acting cylinders. Meets stringent flatness tolerances in statistical note (c).
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If as wafer lappers/polishers per note (b)(C)
Complete wafer preparation equipment includes positioning cylinders.
If cylinder subassemblies only
Parts vs complete rodless cylinders have different treatments.
If with integrated metrology
Machines testing surface flatness shift to Chapter 90.
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Import Tips & Compliance
• Provide tolerances specs matching statistical note requirements; include end-user semiconductor certification
• Avoid generic descriptions that trigger machinery classification
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