SICK Rodless Cylinder for Wafer Lapping from Germany
Custom SICK rodless cylinders designed for semiconductor wafer lapping/polishing equipment, ensuring ultra-flat surfaces. HTS 8412.21.0060 for rodless linear acting cylinders. Meets stringent flatness tolerances in statistical note (c).
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide tolerances specs matching statistical note requirements; include end-user semiconductor certification
• Avoid generic descriptions that trigger machinery classification