SICK Rodless Cylinder for Wafer Lapping from Japan
Custom SICK rodless cylinders designed for semiconductor wafer lapping/polishing equipment, ensuring ultra-flat surfaces. HTS 8412.21.0060 for rodless linear acting cylinders. Meets stringent flatness tolerances in statistical note (c).
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide tolerances specs matching statistical note requirements; include end-user semiconductor certification
• Avoid generic descriptions that trigger machinery classification