SMC Rodless Pneumatic Cylinder CY3 Series
The SMC CY3 series is a compact rodless pneumatic cylinder using a magnetic piston for linear motion without an external rod, ideal for space-constrained automation tasks. It falls under HTS 8412.21.0060 as a rodless linear acting hydraulic or pneumatic power cylinder. Used in semiconductor wafer handling for precise, backlash-free positioning.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If specially designed for semiconductor wafer transfer
Equipment integral to semiconductor manufacturing processes falls under Chapter 84 heading 8479 per statistical notes.
If equipped with external piston rod
Linear acting cylinders with visible rods are classified separately from rodless designs.
If primarily for precise positioning measurement
Measuring or checking instruments with linear actuators may shift to Chapter 90.
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Import Tips & Compliance
• Verify cylinder bore size and stroke length match statistical suffix requirements; obtain manufacturer's declaration confirming rodless magnetic design
• Ensure pressure ratings comply with ASME standards to avoid reclassification
Related Products under HTS 8412.21.00.60
Festo Rodless Cylinder DGC-K Series
Festo DGC-K rodless cylinders feature integrated guides and magnetic pistons for high-precision linear motion in cleanroom environments. Classified under HTS 8412.21.0060 as rodless hydraulic/pneumatic linear actuators. Commonly used in semiconductor wafer polishing equipment for flat surface preparation.
Parker Hannifin Rodless Linear Actuator OSP-E Series
Parker OSP-E series rodless actuators combine pneumatic drive with mechanical guidance for heavy-duty semiconductor handling. HTS 8412.21.0060 covers these rodless linear acting power cylinders. Applied in crystal boule grinders for precise diameter control.
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Tolomatic B3W Rodless Band Cylinder
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Camozzi Rodless Cylinder Series 35R
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SICK Rodless Cylinder for Wafer Lapping
Custom SICK rodless cylinders designed for semiconductor wafer lapping/polishing equipment, ensuring ultra-flat surfaces. HTS 8412.21.0060 for rodless linear acting cylinders. Meets stringent flatness tolerances in statistical note (c).