SICK Rodless Cylinder for Wafer Lapping from Canada
Custom SICK rodless cylinders designed for semiconductor wafer lapping/polishing equipment, ensuring ultra-flat surfaces. HTS 8412.21.0060 for rodless linear acting cylinders. Meets stringent flatness tolerances in statistical note (c).
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide tolerances specs matching statistical note requirements; include end-user semiconductor certification
• Avoid generic descriptions that trigger machinery classification