Boron-Doped Silicon Wafers
Thin discs of silicon intentionally doped with boron to create p-type semiconductors for use in electronics manufacturing. These wafers serve as the foundational substrate for integrated circuits, transistors, and solar cells. Classified under HTS 3818.00.00.95 as chemical compounds doped for electronics in wafer form.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If not intentionally doped for electronic use
Undoped silicon wafers are classified as pure silicon under Chapter 28, not doped compounds of heading 3818.
If in the form of discs or wafers specifically for semiconductors
More specific statistical suffix applies to semiconductor-grade wafers, distinguishing from other doped forms.
If assembled into processed integrated circuits
Once fabricated into electronic integrated circuits, classification shifts from doped materials to finished processors.
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Import Tips & Compliance
• Verify doping concentration and uniformity certification to meet electronics industry standards and avoid reclassification
• Provide material safety data sheets (MSDS) and purity analysis reports; ensure cleanroom packaging to prevent contamination claims
Related Products under HTS 3818.00.00.95
Aluminum-Doped Zinc Oxide (AZO) Wafers
Transparent conductive oxide wafers doped with aluminum for cost-effective alternatives to ITO in solar cells and touch panels. Provides high transparency and low resistivity. HTS 3818.00.00.95 for doped electronic compounds.
Double-Sided Polished Doped Silicon Wafers
Precision-polished silicon wafers doped on both sides for advanced sensors and MEMS fabrication. Ensures flatness for thin-film deposition in electronics. Covered by HTS 3818.00.00.95.
Phosphorus-Doped N-Type Silicon Wafers
Silicon wafers doped with phosphorus atoms to achieve n-type conductivity, critical for fabricating diodes, MOSFETs, and photovoltaic cells in electronics. The doping alters electrical properties for semiconductor applications. Falls under HTS 3818.00.00.95 as other doped chemical compounds for electronics.
Arsenic-Doped Gallium Arsenide Wafers
Gallium arsenide substrates doped with arsenic or related impurities for high-frequency electronics like RF amplifiers and LEDs. These compound semiconductors offer superior electron mobility for optoelectronics. Covered by HTS 3818.00.00.95 for other doped chemicals in wafer form.
Antimony-Doped Silicon Wafer Substrates
Silicon discs doped with antimony for n-type semiconductors used in power electronics and sensors. Provides higher doping levels than phosphorus for specific high-current applications. HTS 3818.00.00.95 applies to these other doped electronic compounds.
Epitaxial Boron-Doped Silicon Wafers
Silicon wafers with an epitaxial layer doped with boron for advanced CMOS manufacturing and MEMS devices. The epitaxial growth ensures precise thickness control for high-performance electronics. Fits HTS 3818.00.00.95 as other doped wafers for electronics.