Boron-Doped Silicon Wafers from China
Thin discs of silicon intentionally doped with boron to create p-type semiconductors for use in electronics manufacturing. These wafers serve as the foundational substrate for integrated circuits, transistors, and solar cells. Classified under HTS 3818.00.00.95 as chemical compounds doped for electronics in wafer form.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Verify doping concentration and uniformity certification to meet electronics industry standards and avoid reclassification
• Provide material safety data sheets (MSDS) and purity analysis reports; ensure cleanroom packaging to prevent contamination claims