Other
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics > Other
Duty Rate (from China)
Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 3818.00.00.95
Aluminum-Doped Zinc Oxide (AZO) Wafers
Transparent conductive oxide wafers doped with aluminum for cost-effective alternatives to ITO in solar cells and touch panels. Provides high transparency and low resistivity. HTS 3818.00.00.95 for doped electronic compounds.
Double-Sided Polished Doped Silicon Wafers
Precision-polished silicon wafers doped on both sides for advanced sensors and MEMS fabrication. Ensures flatness for thin-film deposition in electronics. Covered by HTS 3818.00.00.95.
Boron-Doped Silicon Wafers
Thin discs of silicon intentionally doped with boron to create p-type semiconductors for use in electronics manufacturing. These wafers serve as the foundational substrate for integrated circuits, transistors, and solar cells. Classified under HTS 3818.00.00.95 as chemical compounds doped for electronics in wafer form.
Phosphorus-Doped N-Type Silicon Wafers
Silicon wafers doped with phosphorus atoms to achieve n-type conductivity, critical for fabricating diodes, MOSFETs, and photovoltaic cells in electronics. The doping alters electrical properties for semiconductor applications. Falls under HTS 3818.00.00.95 as other doped chemical compounds for electronics.
Arsenic-Doped Gallium Arsenide Wafers
Gallium arsenide substrates doped with arsenic or related impurities for high-frequency electronics like RF amplifiers and LEDs. These compound semiconductors offer superior electron mobility for optoelectronics. Covered by HTS 3818.00.00.95 for other doped chemicals in wafer form.
Antimony-Doped Silicon Wafer Substrates
Silicon discs doped with antimony for n-type semiconductors used in power electronics and sensors. Provides higher doping levels than phosphorus for specific high-current applications. HTS 3818.00.00.95 applies to these other doped electronic compounds.
Epitaxial Boron-Doped Silicon Wafers
Silicon wafers with an epitaxial layer doped with boron for advanced CMOS manufacturing and MEMS devices. The epitaxial growth ensures precise thickness control for high-performance electronics. Fits HTS 3818.00.00.95 as other doped wafers for electronics.
Indium-Doped Tin Oxide (ITO) Coated Wafers
Glass or substrate wafers coated with indium tin oxide doped for transparent conductive films in touchscreens and OLED displays. The doping enhances electrical conductivity while maintaining transparency. Classified under HTS 3818.00.00.95 as other doped compounds for electronics.
Nitrogen-Doped Silicon Carbide Wafers
SiC wafers doped with nitrogen for high-power, high-temperature electronics like EV inverters and power supplies. Offers wide bandgap properties for efficient power conversion. HTS 3818.00.00.95 covers these doped compound wafers.
P-Type Gallium Nitride Doped Wafers
GaN wafers with magnesium or other dopants for p-type conductivity in blue LEDs, lasers, and RF devices. Enables high-efficiency optoelectronics and 5G components. Under HTS 3818.00.00.95 for other doped electronic wafers.