Titanium Silicide Powder (TiSi2)
Titanium disilicide (TiSi2) is a contact material in microelectronics for low-resistivity silicide layers in semiconductors. Falls under HTS 2850.00.07.00 as a silicide of titanium, chemically defined. Used in VLSI fabrication for source/drain contacts.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If doped silicon for electronics in wafer form
Doped chemical elements as wafers classify in 3818 per chapter note.
If silicide of other metals like molybdenum
Silicides segregated by metal base within 2850 subheadings.
If in sputtering target preparations
Prepared chemical goods for specific processes often in 3824.
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Import Tips & Compliance
• Provide SEM/EDS composition data; critical for CBP to confirm silicide vs. alloy
• Comply with Wassenaar Arrangement if high-purity for advanced semiconductors
Related Products under HTS 2850.00.07.00
Titanium Hydride Powder
Titanium hydride (TiH2) is a chemically defined hydride of titanium used in powder metallurgy and as a hydrogen storage material. It falls under HTS 2850.00.07.00 as a hydride of titanium, distinct from carbides in heading 2849. This fine powder reacts with hydrogen under specific conditions to form the hydride compound.
Titanium Nitride Powder (TiN)
Titanium nitride (TiN) is a refractory ceramic material used for coatings, cutting tools, and wear-resistant parts due to its high hardness. Classified under HTS 2850.00.07.00 as a chemically defined nitride of titanium, separate from carbides. The golden-colored powder is applied via PVD or CVD processes.
Sodium Azide Titanium Complex
A complex azide compound incorporating titanium, used in specialty pyrotechnics and airbag inflators. Classified under HTS 2850.00.07.00 as an azide of titanium, meeting chemically defined criteria. Highly reactive and shock-sensitive.
Titanium Aluminum Nitride Powder (TiAlN)
TiAlN is a ternary nitride coating material offering superior oxidation resistance for high-speed machining tools. It qualifies under HTS 2850.00.07.00 as a chemically defined nitride of titanium. Provides thermal barrier properties up to 900°C.
Titanium Boride Nanoparticles
Nano-sized TiB2 particles (<100nm) for advanced composites and thermal management applications. Classified as titanium boride under HTS 2850.00.07.00 due to chemical definition. Enhanced sinterability compared to micron powders.
Titanium Silicide Sputtering Target Material
High-purity TiSi2 powder pressed for thin-film deposition in semiconductor manufacturing. Remains classified as titanium silicide under HTS 2850.00.07.00 as the chemical compound form. Used for silicide gate formation.