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Titanium Silicide Powder (TiSi2) from Japan

Titanium disilicide (TiSi2) is a contact material in microelectronics for low-resistivity silicide layers in semiconductors. Falls under HTS 2850.00.07.00 as a silicide of titanium, chemically defined. Used in VLSI fabrication for source/drain contacts.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Provide SEM/EDS composition data; critical for CBP to confirm silicide vs. alloy

Comply with Wassenaar Arrangement if high-purity for advanced semiconductors