Titanium Silicide Powder (TiSi2) from Japan
Titanium disilicide (TiSi2) is a contact material in microelectronics for low-resistivity silicide layers in semiconductors. Falls under HTS 2850.00.07.00 as a silicide of titanium, chemically defined. Used in VLSI fabrication for source/drain contacts.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide SEM/EDS composition data; critical for CBP to confirm silicide vs. alloy
• Comply with Wassenaar Arrangement if high-purity for advanced semiconductors