High-Purity Fluorine Gas for Semiconductor Etching

Ultra-pure F2 gas in specialized monel-lined cylinders for plasma etching in microchip manufacturing. HTS 2801.30.10.00 applies as chemically defined elemental fluorine, essential for precise silicon dioxide removal in electronics.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China3.7%+35.0%38.7%
🇲🇽Mexico3.7%+10.0%13.7%
🇨🇦Canada3.7%+10.0%13.7%
🇩🇪Germany3.7%+10.0%13.7%
🇯🇵Japan3.7%+10.0%13.7%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

2812Lower: 13.7% vs 38.7%

If Carbonyl fluoride (COF2) as halide oxide of carbon with fluorine

Classified under 2812 for halide oxides containing fluorine, separate from pure F2.

2901.10Lower: 10% vs 38.7%

If saturated acyclic hydrocarbons fluorinated like tetrafluoroethylene

Organic halogenated hydrocarbons move to Chapter 29.

3818.00.00Higher: 50% vs 38.7%

If doped silicon wafers etched with fluorine residue

Doped semiconductor materials with fluorine processing fall under 3818.

Not sure which classification is right?

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Import Tips & Compliance

Cleanroom-compatible packaging required; provide semiconductor end-use certification to expedite FDA/CBP review

Monitor for nickel fluoride formation in monel containers; common issue is purity drop during transit

Pair with NF2 or CF4 imports under complementary codes for process kits