High-Purity Fluorine Gas for Semiconductor Etching from Japan
Ultra-pure F2 gas in specialized monel-lined cylinders for plasma etching in microchip manufacturing. HTS 2801.30.10.00 applies as chemically defined elemental fluorine, essential for precise silicon dioxide removal in electronics.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Cleanroom-compatible packaging required; provide semiconductor end-use certification to expedite FDA/CBP review
• Monitor for nickel fluoride formation in monel containers; common issue is purity drop during transit
• Pair with NF2 or CF4 imports under complementary codes for process kits