High-Purity Fluorine Gas for Semiconductor Etching from Japan
Ultra-pure F2 gas in specialized monel-lined cylinders for plasma etching in microchip manufacturing. HTS 2801.30.10.00 applies as chemically defined elemental fluorine, essential for precise silicon dioxide removal in electronics.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Cleanroom-compatible packaging required; provide semiconductor end-use certification to expedite FDA/CBP review
• Monitor for nickel fluoride formation in monel containers; common issue is purity drop during transit
• Pair with NF2 or CF4 imports under complementary codes for process kits