High-Purity Fluorine Gas for Semiconductor Etching from China
Ultra-pure F2 gas in specialized monel-lined cylinders for plasma etching in microchip manufacturing. HTS 2801.30.10.00 applies as chemically defined elemental fluorine, essential for precise silicon dioxide removal in electronics.
Duty Rate — China → United States
38.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Cleanroom-compatible packaging required; provide semiconductor end-use certification to expedite FDA/CBP review
• Monitor for nickel fluoride formation in monel containers; common issue is purity drop during transit
• Pair with NF2 or CF4 imports under complementary codes for process kits