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Wafer-Level Burn-in Test System

A temperature-controlled chamber with probe cards that stresses entire wafers at elevated temperatures to screen infant mortality in ICs, monitoring electrical parameters during burn-in. It is used in semiconductor manufacturing to ensure device reliability. This instrument is classified under tariff item 9030.82.00 as it measures or checks semiconductor devices.

Import Duty Rates by Country of Origin

Origin CountryMFN TariffSurtaxesTotal Effective Rate
🇨🇳ChinaFree—Free
🇲🇽MexicoFree—Free
🇺🇸United StatesFree—Free
🇩🇪GermanyFree—Free
🇯🇵JapanFree—Free

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Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

9030.84.00Same rate: Free

If the burn-in system is used for testing packaged ICs rather than wafers

Subheading 9030.84 covers instruments for measuring or checking electrical quantities of integrated circuits, which may apply if the system is used for final IC testing.

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The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Ensure the burn-in system's testing function is documented to support classification under 9030.82.00

• If the system includes temperature control equipment, confirm whether it is integral to the testing function

• Check if the equipment qualifies for duty relief under the Machinery and Equipment Program

Related Products under Tariff item 9030.82.00

3D NAND Wafer Overlay Metrology Tool

A scatterometry-based overlay metrology tool designed for measuring overlay accuracy between multiple layers in 3D NAND flash memory wafers. It uses optical techniques to non-destructively check alignment during semiconductor fabrication, ensuring high-density memory production quality. This instrument falls under tariff item 9030.82.00 as it is specifically for measuring or checking semiconductor wafers.

Advanced Packaging Wafer Test Handler

An automated wafer test handler that probes known good die on wafers for advanced packaging applications, including interposer and through-silicon via structures. It electrically tests semiconductor devices before dicing, ensuring functionality in 2.5D and 3D IC packaging. This equipment is classified under tariff item 9030.82.00 as it is designed for measuring or checking semiconductor devices.

Automated Wafer Alignment Verification System

A machine vision system that verifies fiducial marks and alignment features on semiconductor wafers for photolithography stepper accuracy. It ensures precise multi-layer IC patterning by checking alignment before exposure. This instrument falls under tariff item 9030.82.00 as it is used for measuring or checking semiconductor wafers.

Compound Semiconductor Wafer Analyzer

A multi-technique analyzer for compound semiconductor wafers such as GaAs, GaN, and SiC, measuring sheet resistance, carrier mobility, and Hall effect. It is essential for RF and power electronics production, providing critical electrical characterization. This instrument is classified under tariff item 9030.82.00 as it measures or checks semiconductor wafers.

IC Parametric Electrical Analyzer

A precision instrument that tests electrical parameters of individual transistors and ICs on wafers for process control monitoring, measuring leakage current, threshold voltage, and other characteristics. It is used during semiconductor fabrication to ensure device quality. This instrument falls under tariff item 9030.82.00 as it is specifically for measuring or checking semiconductor devices.

Integrated Circuit Tester Prober Station

An automated prober station that electrically tests individual ICs and devices on wafers for functionality before dicing. It includes probe cards and test head interfaces to ensure semiconductor devices meet specifications. This equipment is classified under tariff item 9030.82.00 as it is used for measuring or checking semiconductor devices.