Wafer-Level Burn-in Test System from Japan
A temperature-controlled chamber with probe cards that stresses entire wafers at elevated temperatures to screen infant mortality in ICs, monitoring electrical parameters during burn-in. It is used in semiconductor manufacturing to ensure device reliability. This instrument is classified under tariff item 9030.82.00 as it measures or checks semiconductor devices.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the burn-in system's testing function is documented to support classification under 9030.82.00
• If the system includes temperature control equipment, confirm whether it is integral to the testing function
• Check if the equipment qualifies for duty relief under the Machinery and Equipment Program