Advanced Packaging Wafer Test Handler
An advanced packaging wafer test handler is an automated system that probes known good die (KGD) on wafers for 2.5D/3D IC packaging applications. It tests interposer and through-silicon via (TSV) structures, ensuring the functionality of semiconductor devices before dicing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the handler tests devices after singulation or in packaged form.
Testing of individual semiconductor devices after dicing is covered under 9030.89.00.
If the handler is primarily for transporting or handling wafers during manufacturing.
Machines for the manufacture of semiconductor devices may fall under 8486.20.00.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify the handler under 9030.82.00 as it checks semiconductor devices on wafers
• Provide CBSA with a detailed description of the testing functions, including TSV and interposer testing capabilities
• Check if the equipment meets Canadian electrical safety standards (CSA) for automated machinery
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