Advanced Packaging Wafer Test Handler from United States
An advanced packaging wafer test handler is an automated system that probes known good die (KGD) on wafers for 2.5D/3D IC packaging applications. It tests interposer and through-silicon via (TSV) structures, ensuring the functionality of semiconductor devices before dicing.
Duty Rate — United States → Canada
0%
Import Tips
• Classify the handler under 9030.82.00 as it checks semiconductor devices on wafers
• Provide CBSA with a detailed description of the testing functions, including TSV and interposer testing capabilities
• Check if the equipment meets Canadian electrical safety standards (CSA) for automated machinery