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Advanced Packaging Wafer Test Handler from China

An advanced packaging wafer test handler is an automated system that probes known good die (KGD) on wafers for 2.5D/3D IC packaging applications. It tests interposer and through-silicon via (TSV) structures, ensuring the functionality of semiconductor devices before dicing.

Duty Rate — China → Canada

0%

Import Tips

• Classify the handler under 9030.82.00 as it checks semiconductor devices on wafers

• Provide CBSA with a detailed description of the testing functions, including TSV and interposer testing capabilities

• Check if the equipment meets Canadian electrical safety standards (CSA) for automated machinery