Advanced Packaging Wafer Test Handler from China
An automated wafer test handler that probes known good die on wafers for advanced packaging applications, including interposer and through-silicon via structures. It electrically tests semiconductor devices before dicing, ensuring functionality in 2.5D and 3D IC packaging. This equipment is classified under tariff item 9030.82.00 as it is designed for measuring or checking semiconductor devices.
Duty Rate — China → Canada
0%
Import Tips
• Classify the handler under 9030.82.00 and include probe cards and interfaces as part of the machine if imported together
• Check if the equipment is eligible for the Accelerated Capital Cost Allowance for clean energy or manufacturing equipment
• Ensure the CBSA declaration includes the model and serial number to facilitate customs clearance